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Preci-Dip Catalog

Contact Technology

Preci-Dip Contact Technology Catalog (PDF document 1.5 MB)

INTRODUCTION
PRECI-DIP, a world wide leading manufacturer of precision machined contacts and related interconnect components is continuously improving its ability to design innovative contacts. This catalog provides general technical information on preci-dip contacts. It should help potential users make the best technical choice for a given application.

If no adequate solution can be found there, please contact us, as only a selected choice of all existing contacts is displayed. Furthermore, PRECI-DIP will be pleased to offer full support to design and manufacture customer specific contacts.

3 main groups of contact products are described and offered:

  • Spring-loaded contacts
  • Socket contacts also called female contacts or pin receptacles
  • Pin or male contacts and PCB terminals

PCB Connectors

PCB connectors

GENERAL SPECIFICATIONS

The values listed below are general specs applying for preci-dip socket and pin connectors. Please see individual catalog page for additional and product specific technical data.

Operating temperature range: -55 ... +125 °C
Climatic category (IEC): 55/125/21
Operating humidity range: annual mean 75 %
Max working voltage: 100 VRMS/150 VDC (2.54 mm grid)

Preci-dip products are recognized by Underwriters Laboratories Inc. and listed under "Connectors for Use in Data, Signal, Control and Power Applications", File Nr. E174442.

Mechanical characteristics
Clip retention Min. 40 N (no displacement under axial force applied)
Contact (sleeve / clip) retention Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2


Electrical characteristics
Insulation resistance between any two adjacent contacts Min. 10'000 MΩ at 500 V AC
Capacitance between any two adjacent contacts Max. 1 pF
Air and creepage distances between any two adjacent contacts
SERIES
3xx/4xx/7xx
80x
83x
85x
86x
mm
0.7
0.85 / 0.7
0.5
0.4 / 0.5
0.5


Environmental characteristics
The sockets withstand the following environmental tests without mechanical and electrical defects:
  • Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16h
  • Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH, 1 cycle of 24 h
  • Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h
  • Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min
  • Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g, 1 octave/min, 10 cycles for each axis
  • Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis
During the above two tests no contact interruption >50 ns does appear.
  • Solderability J-STD-002A, Test A, 245°C, 5 s solder alloy SnAg3.8Cu0.7
  • Resistance to soldering heat J-STD-0020C, 260°C, 20 s
  • Moisture sensitivity J-STD-020C level 1
  • Resistance to corrosion:
    1. Salt spray test IEC 60068-2-11.Ka: 48 h
    2. Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2, 25 °C, 75 %rH
    3. Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S, 25 °C, 75 %rH


Solderless compliant Press-Fit characteristics
Press-fit characteristics measured acc. to IEC 60352-5
  • Press-in force:
90 N max. (at min. hole dia.) / 65 N typ.
  • Push-out force:
30 N min. (at max. hole dia.) / 50 N typ.
  • Push-out 3rd cycle:
20 N min. (at max. hole dia.)
 
PCB Hole Dimensions
  • 2 mm grid
Finished hole Ø: 0.7 + 0.09/-0.06 mm
Drilled hole Ø: 0.8 ± 0.02 mm
  • 2.54 mm grid
Finished hole Ø: 1 + 0.09/-0.06 mm
Drilled hole Ø: 1.15 ± 0.02 mm
 
PCB Hole Plating
PCB surface finish Hole plating
  • Tin
5-15 µm tin over min. 25 µm copper
  • Copper
min. 25 µm copper
  • Gold over nickel
0.05-0.2 µm gold over 2.5-5 µm nickel
over min. 25 µm copper


Packaging
  • Standard connector packaging is card box.
  • SMD mount connectors available on request with Tape & Reel packaging acc. to EIA Standard 481. These products are marked with the symbol
 

Spring-loaded Connectors & PAD Connectors

spring-loaded connectors PAD connectors

GENERAL SPECIFICATIONS

The values listed below are general specs applying for preci-dip spring-loaded connectors. Please see individual catalog page for additional and product specific technical data.

Operating temperature range: -55 ... +125 °C
Climatic category (IEC): 55/85/21
Operating humidity range: annual mean 75 %
Max working voltage: 100 VRMS/150 VDC (2.54 mm grid)

Preci-dip products are recognized by Underwriters Laboratories Inc. and listed under "Connectors for Use in Data, Signal, Control and Power Applications", File Nr. E174442.

Mechanical characteristics
  Basic LOW RESISTANCE
HOLLOW PISTON TYPE SHAPED PISTON TYPE CLIP IN-LINE DESIGN TYPE
Min. initial height 3 mm 6 mm 10 mm
Stroke/height ratio Max. 0.3 Max. 0.2 Max. 0.15
Max. stroke 2 mm 2 mm 1.5 mm
Min. initial spring force 0.2 N 0.2 N 0.2 N


ELECTRICAL CHARACTERISTICS
Insulation resistance between any two adjacent contacts Min. 10'000 MΩ at 500 V AC
Capacitance between any two adjacent contacts Max. 1 pF


Environmental characteristics
The sockets withstand the following environmental tests without mechanical and electrical defects:
  • Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16 h
  • Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH, 1 cycle of 24 h
  • Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h
  • Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min
  • Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g, 1 octave/min, 10 cycles for each axis
  • Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis
During the above two tests no contact interruption >50 ns does appear.
  • Solderability J-STD-002A, Test A, 245°C, 5 s, solder alloy SnAg3.8Cu0.7
  • Resistance to soldering heat J-STD-020C, 260°C, 20 s
  • Moisture sensitivity J-STD-020C level 1
  • Resistance to corrosion:
    1. Salt spray test IEC 60068-2-11.Ka: 48 h
    2. Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2, 25 °C, 75 %rH
    3. Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S, 25 °C, 75 %rH


Packaging
  • Standard connector packaging is card box.
  • SMD mount connectors available on request with Tape & Reel packaging acc. to EIA Standard 481. These products are marked with the symbol
 

Dil Sockets

DIL sockets

GENERAL SPECIFICATIONS

The values listed below are general specs applying for preci-dip DIL sockets. Please see individual catalog page for additional and product specific technical data.

OPERATING TEMPERATURE RANGE: -55 ... +125 °C
CLIMATIC CATEGORY (IEC): 55/125/21
OPERATING HUMIDITY RANGE: annual mean 75 %
MAX WORKING VOLTAGE: 100 VRMS/150 VDC

Preci-dip sockets are recognized by Underwriters Laboratories Inc. and listed under "Connectors for Use in Data, Signal, Control and Power Applications", File Nr. E174442.

MECHANICAL CHARACTERISTICS
CLIP RETENTION Min. 40 N (no displacement under axial force applied)
CONTACT (SLEEVE / CLIP) RETENTION Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2


ELECTRICAL CHARACTERISTICS
INSULATION RESISTANCE AT 500 V AC BETWEEN ANY TWO ADJACENT CONTACTS Min. 10'000 MΩ
CAPACITANCE BETWEEN ANY TWO ADJACENT CONTACTS Max. 1 pF
AIR AND CREEPAGE DISTANCES BETWEEN ANY TWO ADJACENT CONTACTS
(Min. 0.2 mm FOR SHRINK-DIP SOCKETS)
Min. 0.6 mm


ENVIRONMENTAL CHARACTERISTICS
The sockets withstand the following environmental tests without mechanical and electrical defects:
  • Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16h
  • Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH, 1 cycle of 24 h
  • Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h
  • Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min
  • Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g, 1 octave/min, 10 cycles for each axis
  • Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis
During the above two tests no contact interruption >50 ns does appear.
  • Solderability J-STD-002A, Test A, 245°C, 5 s solder alloy SnAg3.8Cu0.7
  • Resistance to soldering heat J-STD-0020C, 260°C, 20 s
  • Moisture sensitivity J-STD-020C level 1
  • Resistance to corrosion:
    1. Salt spray test IEC 60068-2-11.Ka: 48 h
    2. Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2, 25 °C, 75 %rH
    3. Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S, 25 °C, 75 %rH


SOLDERLESS COMPLIANT PRESS-FIT CHARACTERISTICS
PRESS-FIT CHARACTERISTICS MEASURED ACC. TO IEC 60352-5
  • Press-in force:
90 N max. (at min. hole dia.) / 65 N typ.
  • Push-out force:
30 N min. (at max. hole dia.) / 50 N typ.
  • Push-out 3rd cycle:
20 N min. (at max. hole dia.)
 
PCB HOLE DIMENSIONS
  • 2.54 mm grid
Finished hole Ø: 1 + 0.09/-0.06 mm
Drilled hole Ø: 1.15 ± 0.025 mm
 
PCB HOLE PLATING
PCB surface finish Hole plating
  • Tin
5-15 µm tin over min. 25 µm copper
  • Copper
min. 25 µm copper
  • Gold over nickel
0.05-0.2 µm gold over 2.5-5 µm nickel
over min. 25 µm copper


PACKAGING
  • Standard connector packaging is card box.
  • SMD mount connectors available on request with Tape & Reel packaging acc. to EIA Standard 481. These products are marked with the symbol 
 

PGA / BGA / PLCC Sockets

PGA/BGA/PLCC sockets

GENERAL SPECIFICATIONS

Preci-Dip PGA / BGA / PLCC Sockets Catalog (PDF document 3.2 MB)

The values listed below are general specs applying for preci-dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.

Operating temperature range: -55 ... +125 °C
Climatic category (IEC): 55/125/21
Operating humidity range: annual mean 75 %
Max working voltage: 100 VRMS/150 VDC (2.54 mm grid)

Preci-dip sockets are recognized by Underwriters Laboratories Inc. and listed under "Connectors for Use in Data, Signal, Control and Power Applications", File Nr. E174442.

Mechanical characteristics
Clip retention Min. 40 N (no displacement under axial force applied)
Contact (sleeve / clip) retention Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2


Electrical characteristics
Insulation resistance between any two adjacent contacts Min. 10'000 MΩ at 500 V AC
Capacitance between any two adjacent contacts Max. 1 pF (PLCC max. 2 pF)
SELF INDUCTANCE PER CONTACT Max. 2 nH


Environmental characteristics
The sockets withstand the following environmental tests without mechanical and electrical defects:
  • Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16h
  • Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH, 1 cycle of 24 h
  • Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h
  • Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min
  • Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g, 1 octave/min, 10 cycles for each axis
  • Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis
During the above two tests no contact interruption >50 ns does appear.
  • Solderability J-STD-002A, Test A, 245°C, 5 s solder alloy SnAg3.8Cu0.7
  • Resistance to soldering heat J-STD-0020C, 260°C, 20 s
  • Moisture sensitivity J-STD-020C level 1
  • Resistance to corrosion:
    1. Salt spray test IEC 60068-2-11.Ka: 48 h
    2. Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2, 25 °C, 75 %rH
    3. Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S, 25 °C, 75 %rH


Solderless compliant Press-Fit characteristics
Press-fit characteristics measured acc. to IEC 60352-5
  • Press-in force:
90 N max. (at min. hole dia.) / 65 N typ.
  • Push-out force:
30 N min. (at max. hole dia.) / 50 N typ.
  • Push-out 3rd cycle:
20 N min. (at max. hole dia.)
 
PCB Hole Dimensions
  • 2.54 mm grid
Finished hole Ø: 1 + 0.09/-0.06 mm
Drilled hole Ø: 1.15 ± 0.025 mm
  • Interstitial grid
Finished hole Ø: 0.7 + 0.09/-0.06 mm
Drilled hole Ø: 0.8 ± 0.02 mm
 
PCB Hole Plating
PCB surface finish Hole plating
  • Tin
5-15 µm tin over min. 25 µm copper
  • Copper
min. 25 µm copper
  • Gold over nickel
0.05-0.2 µm gold over 2.5-5 µm nickel
over min. 25 µm copper


Packaging
  • Standard connector packaging is card box.
  • SMD mount connectors available on request with Tape & Reel packaging acc. to EIA Standard 481. These products are marked with the symbol
 

Custom Design

A competitive edge, the ability to innovate, and high productivity are some of the core values at PRECI-DIP. When it comes to Custom Design, there's an additional value: Teamwork. Time and again, turning customer ideas and imagination into reality is a very special challenge. This is one of PRECI-DIP's core strengths.

Everything under one roof: the incomparable advantage of PRECI-DIP becomes even more obvious when it comes to Custom Design. Ready access to material resources is as critical as the expertise of our engineers and the art of developing and designing our own production equipment.

Companies in all industrial sectors value their collaboration with PRECI-DIP for complete product and component solutions – today and tomorrow.

Preci-Dip Custom Design Catalog (PDF document 1.04 MB)

APPLICATION FIELDS
 TELECOMMUNICATION
 DATA PROCESSING AND ACQUISITION
 TRANSPORTATION
 AIRCRAFT, AEROSPACE AND MILITARY
 AUTOMATION AND INDUSTRIAL EQUIPMENT
 TESTING AND MEASURING
 MEDICAL
 PROFESSIONAL AND CONSUMER ELECTRONIC